Principal/Senior Principal Manufacturing Process/Project Engineer - Microelectronics - Maryland, Baltimore

The announced job offer is made public by the firm: Northrop Grumman and it was included in jobs list the date of: 2022-10-22 in the website greenenergyjobsonline.com.

It is announced that they have a job offer at the category of Engineering and the jobs location is in the state of Maryland at the city Baltimore, in the country US - at this current ZipCode: 21201

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At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems Manufacturing Engineering is seeking a Principal/Senior Principal Manufacturing Process/Project Engineer to join the Advanced Packaging Team. The Manufacturing Engineer will be responsible for developing new processes in the realm of microelectronics and advanced packaging manufacturing. This role also requires project management of NCTA/CRAD/IRAD activities tied to advanced packaging and new product development.

The chosen candidate must have excellent verbal and written communication skills; be able to multi-task in a fast-paced, dynamic, and high visibility environment; and work well as part of a team.

Duties include, but are not limited to, the following:

• Ownership and development of microelectronics processes such as wafer bumping and coining, environmental coating, and microelectronics diagnostic equipment
• Management of process development activities, materials, schedule milestones, and budget
• Completion of Production Readiness Reviews following the initial process development activities
• Interacting with peer manufacturing, design, and reliability engineers in a cross-functional environment to understand process and hardware requirements and desired process outputs
• Participating in producibility reviews for new product designs and development of design guidelines for new processes as they are developed
• Ownership of component packaging best practices and testing efforts across multiple component types and packaging styles

This job will be filled as a Principal or a Senior Principal based on the qualifications below.

Basic Qualifications for a Principal:

• Bachelor's degree or higher in Engineering or related STEM area plus 5 years of relevant professional experience (3 years with an MS degree)
• Prior experience developing and maintaining new manufacturing processes with a focus on affordability, producibility, and quality
• Demonstrated ability to lead technical projects, including development and oversight of scope, budget, schedule, resources, and status reports
• Experience developing and revising process documentation and work instructions
• Fluency in MS Office software applications
• Ability to obtain a security clearance (U.S. Citizenship is required)

Basic Qualifications for a Senior Principal:

• Bachelor's degree or higher in Engineering or related STEM area plus 9 years of relevant professional experience (7 years with an MS degree)
• Prior experience developing and maintaining new manufacturing processes with a focus on affordability, producibility, and quality
• Demonstrated ability to lead technical projects, including development and oversight of scope, budget, schedule, resources, and status reports
• Experience developing and revising process documentation and work instructions
• Fluency in MS Office software applications
• Ability to obtain a security clearance (U.S. Citizenship is required)

Preferred Qualifications:

• Prior knowledge of semiconductor RF/digital packaging, materials and assembly processes including some of these: wafer bumping and coining, component pick and place, conformal coating, and component packaging
• Fundamental understanding of semiconductor fabrication processes and technology with strong technical and analytical skills and problem-solving techniques
• Familiarity with process development and control methodologies such as Design of Experiment (DOE), Statistical Process Control (SPC), and 6 Sigma Concepts
• Familiarity with Mil-Std, JEDEC, and Space class hardware requirements

MANUMS

Salary Range: $88,000 USD - $132,000 USD
Salary Range 2: $109,100 USD - $163,700 USD

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The health and safety of our employees and their families is a top priority. The company encourages employees to remain up-to-date on their COVID-19 vaccinations. U.S. Northrop Grumman employees may be required, in the future, to be vaccinated or have an approved disability/medical or religious accommodation, pursuant to future court decisions and/or government action on the currently stayed federal contractor vaccine mandate under Executive Order 14042 .

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit . U.S. Citizenship is required for most positions.